Desmearing is a term used to describe the cleaning of impurity and luting. These occur during the drilling of printed circuit boards (PCB). Laser drilling residues can also be removed with low pressure plasma cleaning. Using one of Diener’s low pressure plasma systems, desmearing is a viable alternative to sulfuric acid, chromatic acid, and permanganate.
To learn more about the use of plasma in manufacturing, please read our eBook titled "Manufacturer’s Surface Activation Guide for Improved Adhesion."