CVD & PECVD - Chemical Vapor Deposition

Chemical Vapor Deposition (CVD) is a method of producing or coating parts with high-performance materials.

Among other industries, it’s used in the semiconductor industry to produce thin films. In CVD, a substrate is exposed to chemical vapors which react and decompose on the surface of the substrate to produce a layer, coating, or material used for input into another process with desired properties.

PECVD is a technique designed to create thin or ultrathin films on the surface of a substrate.

Advantages of this plasma coating technique include:

• The ability to deposit a variety of materials on the substrate or workpiece to confer specific properties (e.g., diamond-like carbon to reduce wear of parts, or silicon compounds with insulating properties, such as SiO2 or HMDSO on electronic devices)
• Operates at low temperatures, which is suitable for heat-sensitive substrates
• Produces thin films of high-quality, uniform thickness, and resistance to cracking
• High-performance adhesion of the film to the substrate
• Can easily and uniformly coat parts with complex geometries and at high rates of deposition